Non-volatile storage using current sensing with biasing of source and P-Well

ABSTRACT

A non-volatile storage device in which current sensing is performed for a non-volatile storage element. A voltage is applied to a selected word line of the first non-volatile storage element, and source and p-well voltages are applied to a source and a p-well, respectively, associated with the non-volatile storage element. The source and p-well voltages are regulated at respective positive DC levels to avoid a ground bounce, or voltage fluctuation, which would occur if the source voltage at least was regulated at a ground voltage. A programming condition of the non-volatile storage element is determined by sensing a current in a NAND string of the non-volatile storage element. The sensing can occur quickly since there is no delay in waiting for the ground bounce to settle.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. provisional patentapplication No. 60/910,397, U.S. provisional patent application No.60/910,400, and U.S. provisional patent application No. 60/910,404, eachof which was filed on Apr. 5, 2007, and each of which is incorporatedherein by reference.

This application is related to the following co-pending, commonlyassigned U.S. patent applications:

U.S. patent application Ser. No. 11/771,982, titled “Method for SensingNegative Threshold Voltages In Non-Volatile Storage Using CurrentSensing,” now U.S. Pat. No. 7,447,079,

U.S. patent application Ser. No. 11/771,987, titled “Non-VolatileStorage With Current Sensing of Negative Threshold Voltages,” nowpublished as U.S. Pat. Publication No. 20080247228,

U.S. patent application Ser. No. 11/771,992, titled “Method for CurrentSensing With Biasing Of Source And P-Well In Non-Volatile Storage,” nowU.S. Pat. No. 7,489,554,

U.S. patent application Ser. No. 11/772,002, titled “Method for SourceBias All Bit Line Sensing in Non-Volatile Storage” now U.S. Pat. No.7,471,567,

U.S. patent application Ser. No. 11/772,009, titled “Non-VolatileStorage with Source Bias All Bit Line Sensing,” now published as U.S.Pat. Publication No. 20090003069,

U.S. patent application Ser. No. 11/772,015, titled “Method ForTemperature Compensating Bit Line During Sense Operations InNon-Volatile Storage,” now published as U.S. Pat. Publication No.20080247254, and

U.S. patent application Ser. No. 11/772,018, titled “Non-VolatileStorage With Temperature Compensation For Bit Line During SenseOperations,” now published as U.S. Pat. Publication No. US08-0247253A1

each of which was filed on Jun. 29, 2007, and each of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to non-volatile memory.

2. Description of the Related Art

Semiconductor memory has become increasingly popular for use in variouselectronic devices. For example, non-volatile semiconductor memory isused in cellular telephones, digital cameras, personal digitalassistants, mobile computing devices, non-mobile computing devices andother devices. Electrically Erasable Programmable Read Only Memory(EEPROM) and flash memory are among the most popular non-volatilesemiconductor memories. With flash memory, also a type of EEPROM, thecontents of the whole memory array, or of a portion of the memory, canbe erased in one step, in contrast to the traditional, full-featuredEEPROM.

Both the traditional EEPROM and the flash memory utilize a floating gatethat is positioned above and insulated from a channel region in asemiconductor substrate. The floating gate is positioned between thesource and drain regions. A control gate is provided over and insulatedfrom the floating gate. The threshold voltage (V_(TH)) of the transistorthus formed is controlled by the amount of charge that is retained onthe floating gate. That is, the minimum amount of voltage that must beapplied to the control gate before the transistor is turned on to permitconduction between its source and drain is controlled by the level ofcharge on the floating gate.

Some EEPROM and flash memory devices have a floating gate that is usedto store two ranges of charges and, therefore, the memory element can beprogrammed/erased between two states, e.g., an erased state and aprogrammed state. Such a flash memory device is sometimes referred to asa binary flash memory device because each memory element can store onebit of data.

A multi-state (also called multi-level) flash memory device isimplemented by identifying multiple distinct allowed/valid programmedthreshold voltage ranges. Each distinct threshold voltage rangecorresponds to a predetermined value for the set of data bits encoded inthe memory device. For example, each memory element can store two bitsof data when the element can be placed in one of four discrete chargebands corresponding to four distinct threshold voltage ranges.

Typically, a program voltage V_(PGM) applied to the control gate duringa program operation is applied as a series of pulses that increase inmagnitude over time. In one possible approach, the magnitude of thepulses is increased with each successive pulse by a predetermined stepsize, e.g., 0.2-0.4 V. V_(PGM) can be applied to the control gates offlash memory elements. In the periods between the program pulses, verifyoperations are carried out. That is, the programming level of eachelement of a group of elements being programmed in parallel is readbetween successive programming pulses to determine whether it is equalto or greater than a verify level to which the element is beingprogrammed. For arrays of multi-state flash memory elements, averification step may be performed for each state of an element todetermine whether the element has reached its data-associated verifylevel. For example, a multi-state memory element capable of storing datain four states may need to perform verify operations for three comparepoints.

Moreover, when programming an EEPROM or flash memory device, such as aNAND flash memory device in a NAND string, typically V_(PGM) is appliedto the control gate and the bit line is grounded, causing electrons fromthe channel of a cell or memory element, e.g., storage element, to beinjected into the floating gate. When electrons accumulate in thefloating gate, the floating gate becomes negatively charged and thethreshold voltage of the memory element is raised so that the memoryelement is considered to be in a programmed state. More informationabout such programming can be found in U.S. Pat. No. 6,859,397, titled“Source Side Self Boosting Technique For Non-Volatile Memory,” and inU.S. Patent App. Pub. 2005/0024939, titled “Detecting Over ProgrammedMemory,” published Feb. 3, 2005; both of which are incorporated hereinby reference in their entirety.

SUMMARY OF THE INVENTION

The present invention provides a non-volatile storage device with acapability for sensing a programming condition of non-volatile storageelements using current sensing and regulating source and p-well voltagesat positive levels.

In one embodiment, a non-volatile storage system includes a set ofnon-volatile storage elements including at least a first non-volatilestorage element, and one or more control circuits in communication withthe set of non-volatile storage elements. The one or more controlcircuits: (a) apply a first voltage to a selected word line which isassociated with the at least a first non-volatile storage element, (b)regulate a source voltage at a positive DC level for a source which isassociated with the at least a first non-volatile storage element duringat least a portion of a time in which the at least a first voltage isapplied, and (c) determine whether the at least a first non-volatilestorage element is in a conductive or non-conductive state using currentsensing while applying the first voltage and regulating the sourcevoltage.

In another embodiment, a non-volatile storage system includes a set ofnon-volatile storage elements including at least a first non-volatilestorage element, and one or more control circuits in communication withthe set of non-volatile storage elements. The one or more controlcircuits: (a) apply a first voltage to a selected word line of the atleast a first non-volatile storage element, (b) regulate source andp-well voltages at respective positive DC levels for a source andp-well, respectively, which are associated with the at least a firstnon-volatile storage element during at least a portion of a time inwhich the at least a first voltage is applied, and (c) sense aprogramming condition of the at least a first non-volatile storageelement relative to a compare point using current sensing, whileapplying the first voltage and regulating the source and p-wellvoltages.

In another embodiment, a non-volatile storage system includes a set ofnon-volatile storage elements including at least a first non-volatilestorage element, and one or more control circuits in communication withthe set of non-volatile storage elements. The one or more controlcircuits: (a) charge a drain associated with the at least a firstnon-volatile storage element so that a potential of the drain exceeds apotential of a source associated with at least a first non-volatilestorage element, (b) apply a first voltage to a selected word line ofthe at least a first non-volatile storage element, (c) regulate sourceand p-well voltages at respective positive DC levels for a source andp-well, respectively, which are associated with the at least a firstnon-volatile storage element during at least a portion of a time inwhich the at least a first voltage is applied, (d) while applying thefirst voltage, and regulating the source and p-well voltages, performingcurrent sensing with respect to a level of a current which flows throughthe at least a first non-volatile storage element and sinks into thesource, and (e) determine a programming condition of the at least afirst non-volatile storage element according to the sensed level ofcurrent.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a NAND string.

FIG. 2 is an equivalent circuit diagram of the NAND string of FIG. 1.

FIG. 3 is a block diagram of an array of NAND flash storage elements.

FIG. 4 depicts a cross-sectional view of a NAND string formed on asubstrate.

FIGS. 5 a-d depict programming of a non-volatile storage element.

FIG. 6 a depicts a configuration of a NAND string and components forsensing.

FIG. 6 b depicts waveforms associated with FIG. 6 a.

FIG. 6 c depicts a sensing process associated with FIGS. 6 a and 6 b.

FIG. 6 d depicts current sensing based on a change in voltage.

FIG. 7 a depicts variations in current and voltage with time due toground bounce during a sense operation.

FIG. 7 b depicts reduced variations in current and voltage with sourcevoltage regulated to a fixed, positive DC level during a senseoperation.

FIG. 7 c depicts another configuration of a NAND string and componentsfor sensing.

FIG. 7 d depicts a sensing process associated with FIGS. 7 a-7 c.

FIG. 8 a depicts a configuration of a NAND string and components,including a current discharge path.

FIG. 8 b depicts a configuration of the NAND string and components ofFIG. 8 a, when voltage sensing occurs.

FIG. 8 c depicts waveforms associated with FIGS. 8 a and 8 b.

FIG. 8 d depicts a sensing process associated with FIGS. 8 a-8 c.

FIG. 9 a depicts a NAND string and components fortemperature-compensated sensing.

FIG. 9 b illustrates a threshold voltage change with temperature

FIG. 9 c illustrates a change in V_(BLC) and V_(BL) with temperature.

FIG. 9 d depicts waveforms associated with FIGS. 9 a-c.

FIG. 9 e depicts a sensing process associated with FIGS. 9 a-d.

FIG. 9 f depicts an erase-verify process.

FIG. 10 a illustrates a change in V_(SOURCE) with temperature.

FIG. 10 b depicts an example of an array of storage elements, includingdifferent sets of NAND strings.

FIG. 11 is a block diagram of a non-volatile memory system using singlerow/column decoders and read/write circuits.

FIG. 12 is a block diagram of a non-volatile memory system using dualrow/column decoders and read/write circuits.

FIG. 13 is a block diagram depicting one embodiment of a sense block.

FIG. 14 depicts an example of an organization of a memory array intoblocks for odd-even and all bit line memory architectures.

FIG. 15 depicts an example set of threshold voltage distributions withsingle pass programming.

FIG. 16 depicts an example set of threshold voltage distributions withmulti-pass programming.

FIGS. 17 a-c show various threshold voltage distributions and describe aprocess for programming non-volatile memory.

FIG. 18 is a flow chart describing one embodiment of a process forprogramming non-volatile memory.

FIG. 19 depicts an example pulse train applied to the control gates ofnon-volatile storage elements during programming.

DETAILED DESCRIPTION

The present invention provides a non-volatile storage device with acapability for sensing a programming condition of non-volatile storageelements using current sensing and regulating source and p-well voltagesat positive levels.

One example of a memory system suitable for implementing the presentinvention uses the NAND flash memory structure, which includes arrangingmultiple transistors in series between two select gates. The transistorsin series and the select gates are referred to as a NAND string. FIG. 1is a top view showing one NAND string. FIG. 2 is an equivalent circuitthereof. The NAND string depicted in FIGS. 1 and 2 includes fourtransistors, 100, 102, 104 and 106, in series and sandwiched between afirst select gate 120 and a second select gate 122. Select gate 120gates the NAND string connection to bit line 126. Select gate 122 gatesthe NAND string connection to source line 128. Select gate 120 iscontrolled by applying the appropriate voltages to control gate 120CG.Select gate 122 is controlled by applying the appropriate voltages tocontrol gate 122CG. Each of the transistors 100, 102, 104 and 106 has acontrol gate and a floating gate. Transistor 100 has control gate 100CGand floating gate 100FG. Transistor 102 includes control gate 102CG andfloating gate 102FG. Transistor 104 includes control gate 104CG andfloating gate 104FG. Transistor 106 includes a control gate 106CG andfloating gate 106FG. Control gate 100CG is connected to word line WL3,control gate 102CG is connected to word line WL2, control gate 104CG isconnected to word line WL1, and control gate 106CG is connected to wordline WL0. The control gates can also be provided as portions of the wordlines. In one embodiment, transistors 100, 102, 104 and 106 are eachstorage elements, also referred to as memory cells. In otherembodiments, the storage elements may include multiple transistors ormay be different than that depicted in FIGS. 1 and 2. Select gate 120 isconnected to select line SGD (drain select gate). Select gate 122 isconnected to select line SGS (source select gate).

FIG. 3 is a circuit diagram depicting three NAND strings. A typicalarchitecture for a flash memory system using a NAND structure willinclude several NAND strings. For example, three NAND strings 320, 340and 360 are shown in a memory array having many more NAND strings. Eachof the NAND strings includes two select gates and four storage elements.While four storage elements are illustrated for simplicity, modern NANDstrings can have up to thirty-two or sixty-four storage elements, forinstance.

For example, NAND string 320 includes select gates 322 and 327, andstorage elements 323-326, NAND string 340 includes select gates 342 and347, and storage elements 343-346, NAND string 360 includes select gates362 and 367, and storage elements 363-366. Each NAND string is connectedto the source line by its select gates (e.g., select gates 327, 347 or367). A selection line SGS is used to control the source side selectgates. The various NAND strings 320, 340 and 360 are connected torespective bit lines 321, 341 and 361, by select transistors in theselect gates 322, 342, 362, etc. These select transistors are controlledby a drain select line SGD. In other embodiments, the select lines donot necessarily need to be in common among the NAND strings; that is,different select lines can be provided for different NAND strings. Wordline WL3 is connected to the control gates for storage elements 323, 343and 363. Word line WL2 is connected to the control gates for storageelements 324, 344 and 364. Word line WL1 is connected to the controlgates for storage elements 325, 345 and 365. Word line WL0 is connectedto the control gates for storage elements 326, 346 and 366. As can beseen, each bit line and the respective NAND string comprise the columnsof the array or set of storage elements. The word lines (WL3, WL2, WL1and WL0) comprise the rows of the array or set. Each word line connectsthe control gates of each storage element in the row. Or, the controlgates may be provided by the word lines themselves. For example, wordline WL2 provides the control gates for storage elements 324, 344 and364. In practice, there can be thousands of storage elements on a wordline.

Each storage element can store data. For example, when storing one bitof digital data, the range of possible threshold voltages (V_(TH)) ofthe storage element is divided into two ranges which are assignedlogical data “1” and “0.” In one example of a NAND type flash memory,the V_(TH) is negative after the storage element is erased, and definedas logic “1.” The V_(TH) after a program operation is positive anddefined as logic “0.” When the V_(TH) is negative and a read isattempted, the storage element will turn on to indicate logic “1” isbeing stored. When the V_(TH) is positive and a read operation isattempted, the storage element will not turn on, which indicates thatlogic “0” is stored. A storage element can also store multiple levels ofinformation, for example, multiple bits of digital data. In this case,the range of V_(TH) value is divided into the number of levels of data.For example, if four levels of information are stored, there will befour V_(TH) ranges assigned to the data values “11”, “10”, “01”, and“00.” In one example of a NAND type memory, the V_(TH) after an eraseoperation is negative and defined as “11”. Positive V_(TH) values areused for the states of “10”, “01”, and “00.” The specific relationshipbetween the data programmed into the storage element and the thresholdvoltage ranges of the element depends upon the data encoding schemeadopted for the storage elements. For example, U.S. Pat. No. 6,222,762and U.S. Patent Application Pub. 2004/0255090, both of which areincorporated herein by reference in their entirety, describe variousdata encoding schemes for multi-state flash storage elements.

Relevant examples of NAND type flash memories and their operation areprovided in U.S. Pat. Nos. 5,386,422, 5,522,580, 5,570,315, 5,774,397,6,046,935, 6,456,528 and 6,522,580, each of which is incorporated hereinby reference.

When programming a flash storage element, a program voltage is appliedto the control gate of the storage element and the bit line associatedwith the storage element is grounded. Electrons from the channel areinjected into the floating gate. When electrons accumulate in thefloating gate, the floating gate becomes negatively charged and theV_(TH) of the storage element is raised. To apply the program voltage tothe control gate of the storage element being programmed, that programvoltage is applied on the appropriate word line. As discussed above, onestorage element in each of the NAND strings share the same word line.For example, when programming storage element 324 of FIG. 3, the programvoltage will also be applied to the control gates of storage elements344 and 364.

FIG. 4 depicts a cross-sectional view of an NAND string formed on asubstrate. The view is simplified and not to scale. The NAND string 400includes a source-side select gate 406, a drain-side select gate 424,and eight storage elements 408, 410, 412, 414, 416, 418, 420 and 422,formed on a substrate 490. A number of source/drain regions, one exampleof which is source drain/region 430, are provided on either side of eachstorage element and the select gates 406 and 424. In one approach, thesubstrate 490 employs a triple-well technology which includes a p-wellregion 492 within an n-well region 494, which in turn is within a p-typesubstrate region 496. The NAND string and its non-volatile storageelements can be formed, at least in part, on the p-well region. A sourcesupply line 404 with a potential of V_(SOURCE) is provided in additionto a bit line 426 with a potential of V_(BL). In one possible approach,a voltage can be applied to the p-well region 492 via a terminal 402. Avoltage can also be applied to the n-well region 494 via a terminal 403.

During a read or verify operation, including an erase-verify operation,in which the condition of a storage element, such as its thresholdvoltage, is ascertained, V_(CGR) is provided on a selected word linewhich is associated with a selected storage element. Further, recallthat the control gate of a storage element may be provided as a portionof the word line. For example, WL0, WL1, WL2, WL3, WL4, WL5, WL6 and WL7can extend via the control gates of storage elements 408, 410, 412, 414,416, 418, 420 and 422, respectively. A read pass voltage, V_(READ), canbe applied to unselected word lines associated with NAND string 400, inone possible boosting scheme. Other boosting schemes apply V_(READ) tosome word lines and lower voltages to other word lines. V_(SGS) andV_(SGD) are applied to the select gates 406 and 424, respectively.

FIGS. 5 a-d depict programming of a non-volatile storage element. In onepossible programming technique, a lower page, middle page and upper pageare programmed in three steps as depicted at FIGS. 5 a, 5 b and 5 c,respectively. When programming the lower page of data after an eraseoperation, two V_(TH) distributions 510 and 512 are provided. The lowestdistribution 510 represents the erased state and has a negative V_(TH).Next, the first and second V_(TH) distributions 520 and 522,respectively, of FIG. 5 b are obtained from the first V_(TH)distribution 510 of FIG. 5 a, and the third and fourth V_(TH)distributions 524 and 526, respectively, of FIG. 5 b are obtained fromthe second V_(TH) distribution 512 of FIG. 5 a. The first and secondV_(TH) distributions of FIG. 5 c, representing the final erased state Eand a first programmed state A, respectively, are obtained from thefirst V_(TH) distribution 520 of FIG. 5 b. The third and fourth V_(TH)distributions of FIG. 5 c, representing the second and third programmedstates B and C, respectively, are obtained from the second V_(TH)distribution 522 of FIG. 5 b. The fifth and sixth V_(TH) distributionsof FIG. 5 c, representing the fourth and fifth programmed states D andE, respectively, are obtained from the third V_(TH) distribution 524 ofFIG. 5 b. The seventh and eight V_(TH) distributions of FIG. 5 c,representing the sixth and seventh programmed states F and G,respectively, are obtained from the fourth V_(TH) distribution 526 ofFIG. 5 b. Further, code words 111, 011, 001, 101, 100, 000, 010 and 110may be associated with the states E, A, B, C, D, E, F and G,respectively.

States E and A are examples of negative threshold voltage states.Depending on the implementation, one or more states can be negativethreshold voltage states.

FIG. 5 c also depicts verify voltages which are used to obtain thedistributions indicated. Specifically, verify voltages V_(VE), V_(VA),V_(VB), V_(VC), V_(VD), V_(VE), V_(VF) and V_(VG) are associated withdistributions E, A, B, C, D, E, F and G, respectively. Duringprogramming, the threshold voltages of storage elements which are to beprogrammed to a given distribution are compared to the associated verifyvoltage. The storage elements receive programming pulses via anassociated word line until their threshold voltage is verified to haveexceeded the associated verify voltage.

FIG. 5 d depicts read voltages which are used to read the programmingstate of a storage element. Once the storage elements have beenprogrammed, they can subsequently be read using read voltages V_(RA),V_(RB), V_(RC), V_(RD), V_(RE), V_(RF) and V_(RG). One or more storageelements, typically associated with a common word line, are compared toeach read voltage to determine whether their threshold voltage exceedsthe read voltage. The state of the storage element can then bedetermined by the highest read voltage which is exceeded. The readvoltages are provided between the neighboring states.

Note that the programming process depicted is one possible example asother approaches are possible.

Current Sensing Of Negative Threshold Voltage

In non-volatile storage devices, including those using NAND memorydesigns, a satisfactory methodology has not been available to usecurrent sensing for sensing negative threshold voltage states ofnon-volatile storage elements during read or verify operations. Voltagesensing has been used but has been found to take a long time tocomplete. Further, due to bit line-to-bit line capacitive coupling andother effects, voltage sensing has been unsuitable for all bit linesensing, in which sensing is performed on a group of adjacent storageelements concurrently. One possible solution involves regulating thesource voltage and p-well voltage to some fixed, positive DC levelduring sensing when using current sensing, and connecting the controlgate of the sensed storage element, via its associated word line, to alower potential than the source and p-well voltage. It is also possiblefor the source voltage and p-well voltage to differ. With thismethodology of combining biasing of the source and the p-well to somefixed potential, it is possible to sense one or more negative thresholdvoltage states using current sensing. Further, current sensing iscompatible with all bit line sensing since it avoids many of thedisadvantages of voltage sensing.

FIG. 6 a depicts a configuration of a NAND string and components forsensing. In a simplified example, a NAND string 612 includes fourstorage elements which are in communication with word lines WL0, WL1,WL2 and WL3, respectively. In practice, additional storage elements andword lines can be used. Further, additional NAND strings are typicallyarranged adjacent to one another in a block or other set of non-volatilestorage elements (see, e.g., FIG. 14). The storage elements are coupledto a p-well region of a substrate. A bit line 610 having a voltageV_(BL) is depicted, in addition to sense components 600. In particular,a BLS (bit line sense) transistor 606 is coupled to the bit line 610.The BLS transistor 606 is a high voltage transistor, and is opened inresponse to a control 608 during sense operations. A BLC (bit linecontrol) transistor 604 is a low voltage transistor which is opened inresponse to the control 608 to allow the bit line to communicate with acurrent sensing module 602. During a sense operation, such as a read orverify operation, a pre-charge operation occurs in which a capacitor inthe current sensing module 602 is charged. The BLC transistor 604 may beopened to allow the pre-charging. Also during the sense operation, for astorage element having a negative threshold voltage state, a positivevoltage is applied to a word line of one or more storage elementsinvolved in the operation. The use of a positive voltage for theselected word line in a sensing operation in which a negative thresholdvoltage is sensed is advantageous since a negative charge pump is notneeded to provide a negative word line voltage. The incorporation of anegative charge pump into many non-volatile storage systems wouldrequire substantial process study and modification.

For example, assume the selected word line is WL1. The voltage on WL1 iscoupled to the control gates of the storage elements on the word line asthe control gate read voltage V_(CGR). Further, a positive voltageV_(SOURCE) can be applied to the source side of the NAND string 630 anda positive voltage V_(P-WELL) can be applied to the p-well. V_(SOURCE)and V_(P-WELL) are greater than V_(CGR), in one implementation.V_(SOURCE) and V_(P-WELL) can differ from one another, or they can becoupled to the same DC voltage, V_(DC). Further, V_(DC)>V_(CGR). As anexample, V_(DC) can be in the range of about 0.4 to 1.5 V, e.g., 0.8 V.A higher V_(DC) allows sensing of more negative threshold voltagestates. For example, first and second negative threshold voltage statesV_(TH1)=−1.0 V and V_(TH2)=−0.5 V might be sensed using V_(DC)=1.5 V andV_(DC)=1.0 V, respectively. V_(DC) can be set at a level such thatV_(DC)−V_(TH)>0 V. Generally, for sensing a negative threshold voltage,the word line and source voltages are set so that the gate-to-sourcevoltage is less than zero, i.e., V_(GS)<0 V. The selected storageelement is conductive if the gate-to-source voltage is greater than thestorage element's threshold voltage, i.e., V_(GS)>V_(TH). For sensing apositive threshold voltage, the source and p-well can be kept at thesame voltage while the selected word line voltage is adjusted.

At the drain side of the NAND string 630, the BLS transistor 610 isturned on, e.g., made conductive or opened. Additionally, a voltageV_(BLC) is applied to the BLC transistor 600 to make it conductive. Thepre-charged capacitor in the current sensing module 602 dischargesthrough the bit line and into the source so that the source acts as acurrent sink. The pre-charged capacitor at the drain of the NAND stringmay be pre-charged to a potential which exceeds a potential of thesource so that a current flows through the selected non-volatile storageelement and sinks into the source when the selected storage element isin the conductive state.

In particular, if the selected storage element is in a conductive statedue to the application of V_(CGR), a relatively high current will flow.If the selected storage element is in a non-conductive state, no orrelatively little current will flow. The current sensing module 602 cansense the cell/storage element current, i_(CELL). In one possibleapproach, the current sensing module determines a voltage drop which istied to a fixed current flow by the relationship ΔV=i·t/C, where ΔV isthe voltage drop, i is the fixed current, t is a predetermined dischargetime period and C is the capacitance of the pre-charged capacitor in thecurrent sensing module. See also FIG. 6 d, which depicts voltage dropwith time for different lines of fixed current. The greater voltagedrops represent higher currents. At the end of a given discharge period,since i and C are fixed, ΔV for a given current can be determined. Inone approach, a p-mos transistor is used to determine a level of ΔVrelative to a demarcation value. In another possible approach, a cellcurrent discriminator serves as a discriminator or comparator of currentlevels by determining whether the conduction current is higher or lowerthan a given demarcation current.

Voltage sensing, in contrast, does not involve sensing a voltage dropwhich is tied to a fixed current. Instead, voltage sensing involvesdetermining whether charge sharing occurs between a capacitor in avoltage sensing module and a capacitance of the bit line. Current is notfixed or constant during the sensing. Little or no charge sharing occurswhen the selected storage element is conductive, in which case thevoltage of the capacitor in the voltage sensing module does not dropsignificantly. Charge sharing does occur when the selected storageelement is non-conductive, in which case the voltage of the capacitor inthe voltage sensing module does drop significantly.

The current sensing module 602 thus can determine whether the selectedstorage element is in a conductive or non-conductive state by the levelof current. Generally, a higher current will flow when the selectedstorage element is in a conductive state and a lower current will flowwhen the selected storage element is in a non-conductive state. Athreshold voltage of the selected storage element is above or below acompare level, such as a verify level (see FIG. 5 c) or a read level(see FIG. 5 d), when it is in a non-conductive state or a conductivestate, respectively.

FIG. 6 b depicts waveforms associated with FIG. 6 a. Waveforms 620depict V_(SOURCE) and V_(P-WELL), V_(BL) and V_(BLC). V_(SOURCE) andV_(P-WELL) are set at an elevated level at t1 during the senseoperation. In one approach, such as when the sense operation involves anegative threshold voltage, V_(SOURCE) and V_(P-WELL) exceed V_(CGR).However, V_(SOURCE) and V_(P-WELL) need not exceed V_(CGR), e.g., whenthe sense operation involves a positive threshold voltage. V_(BL)increases with V_(SOURCE) between t1 and t2. At t2, the pre-chargedcapacitor is discharged, increasing V_(BL). Thus, a potential of a drain(e.g., V_(BL)) associated with the selected non-volatile storage elementis above a potential of a source (e.g., V_(SOURCE)) associated with theselected non-volatile storage element. V_(BLC) tracks V_(BL) but isslightly higher due to the threshold voltage of the BLC transistor. Inpractice, after rising, V_(BL) will drop slightly (not shown) if currentflows in the NAND string. For example, V_(BL) may rise to 1 V whenV_(BLC=)2 V and the threshold voltage of the BLC transistor is 1 V. Whensensing, if current flows, V_(BL) may drop from 1 V to 0.9 V, forinstance. Waveform 622 depicts a voltage applied to the BLS transistor,indicating it is conductive between t0 and t5. Waveform 624 depicts asense signal which is a control signal indicating the time t after thecapacitor starts discharging in the current sensing module.

Waveforms 626 and 628 depict a sensed voltage which is tied to a fixedcurrent for the selected bit line. A determination can be made at t3 asto whether the voltage exceeds a demarcation level. It can be concludedthat the selected storage element is conductive when the voltage dropsbelow the demarcation level (e.g., line 628). The selected storageelement is non-conductive if the voltage does not drop below thedemarcation level (e.g., line 626).

FIG. 6 c depicts a sensing process associated with FIGS. 6 a and 6 b. Anoverview of the sensing process is provided. In this and the otherflowcharts, the steps depicted do not necessary occur as discrete stepsand/or in the sequence depicted. A sense operation, such as a read orverify operation, begins at step 640. Step 642 includes opening the BLSand BLC transistors to pre-charge the bit line. Step 644 includessetting the word line voltages. Step 646 includes setting V_(SOURCE) andV_(P-WELL). Step 648 includes determining whether the storage element isconductive or non-conductive using current sensing. If another senseoperation is to be performed, at decision step 650, the control flowcontinues at step 640. Otherwise, the process ends at step 652.

Multiple sensing operations can be performed successively, for example,one for each verify or read level. In one approach, the same source andp-well voltages are applied in each sense operation, but the selectedword line voltage is changed. Thus, in a first sensing operation, afirst voltage can be applied to the control gate/word line of a selectedstorage element, the source voltage applied to the source, and thep-well voltage applied to the p-well. A determination is then made as towhether the storage element is in a conductive state or a non-conductivestate using current sensing while applying the first voltage and thesource voltage. A second sensing operation includes applying a secondvoltage to the control gate while applying the same source and p-wellvoltages. A determination is then made as to whether the storage elementis in a conductive state or a non-conductive state. Successive sensingoperations similarly can vary the selected word line voltage while usingthe same source and p-well voltages.

Further, sensing can be performed concurrently for multiple storageelements which are associated with a common word line and source. Themultiple storage elements may be in adjacent or non-adjacent NANDstrings. All bit line sensing, discussed previously, involves concurrentsensing of storage elements in adjacent NAND strings. In this case, thesensing includes determining, in concurrent sensing operations, whethereach of the non-volatile storage elements is in the conductive ornon-conductive state using current sensing.

Current Sensing With Biasing Of Source And P-Well

In non-volatile storage devices including those using NAND memorydesigns, current sensing can be used for sensing threshold voltagestates of non-volatile storage elements during read or verifyoperations. However, such current sensing has resulted in variations or“bouncing” of a source voltage, especially at a ground voltage. Thedegree of the bouncing depends on the level of current through thestorage elements. Moreover, the bouncing can result in sensing errors.One method of controlling cell source bounce during sensing is to senseusing at least two strobes. This can minimize the effect of cell sourcebounce. For example, with current sensing, a current in the NAND stringof the selected storage element may be sensed at each strobe from acontrol. A relatively high or otherwise inaccurate bounce current may bepresent at the first strobe, while a lower current is present by thetime of the second strobe, where the lower current more accuratelyrepresents the sensed state of the storage element. However, the need touse an additional strobe to wait for the current to settle down consumesadditional current and sense time. See FIG. 7 a, which depictsvariations in current and voltage with time due to ground bounce duringa sense operation.

Another technique is to couple the source to the gate and drain of thestorage elements. However, this technique is complicated, requiringextra circuits, and causing some impact on die size and powerconsumption of the memory chip. Moreover, this technique might not workvery well due to RC delays from the source to the gate of the storageelements.

One approach which generally avoids these disadvantages is to regulatethe source and p-well to some fixed positive DC level, instead of toground, during sensing. By keeping the source and p-well at the fixed DClevel, bouncing in the source voltage is avoided, so we can sense datausing just one strobe. As a result, sense time and power consumption arereduced. Further, there is no need for significant additional circuitry,so die size is not adversely impacted. It is also possible to ground thep-well while regulating the source voltage at a fixed, positive DClevel. Regulating the source voltage to a fixed, positive DC level canbe achieved more readily than regulating the source voltage to groundsince the regulating circuit need only sense positive voltages. Avoltage regulator typically works by adjusting its output based on acomparison of a monitored level, e.g., of the source, to an internalreference voltage. If the monitored level drops below the internalreference voltage, the voltage regulator can increase its output.Similarly, if the monitored level increases above the internal referencevoltage, the voltage regulator can lower its output. A voltage regulatormay use an op-amp, for instance. However, if the reference voltage is atground, the voltage regulator generally cannot lower its output below 0V if the monitored level becomes greater than 0 V. Moreover, the voltageregulator may not be able to distinguish monitored levels below 0 V.Regulating the source voltage to a fixed, positive DC level thus avoidsground bounce and can reduce current consumption and sense time. SeeFIG. 7 b, which depicts reduced variations in current and voltage withsource voltage regulated to a fixed, positive DC level during a senseoperation.

FIG. 7 c depicts another configuration of a NAND string and componentsfor sensing. The configuration corresponds to that provided in FIG. 6 aexcept a voltage regulator 720 is depicted. As mentioned, the sourcevoltage and p-well voltage can be regulated to a fixed, positive DClevel during sense operations.

During a sense operation, such as a read or verify operation, of astorage element, a voltage is applied to a word line of one or morestorage elements involved in the operation. For example, assume theselected word line is WL1. This voltage is coupled to the control gatesof the storage elements on the word line as the control gate readvoltage V_(CGR). Further, a fixed DC voltage can be applied to thesource side of the NAND string 612 as well as to the p-well as thesource voltage V_(SOURCE) and the p-well voltage V_(P-WELL),respectively. When the threshold voltage is negative, V_(CGR) can bepositive, and V_(SOURCE) and V_(P-WELL) can be greater than V_(CGR), inone implementation. When the threshold voltage is positive, V_(CGR) canbe greater than V_(SOURCE) and V_(P-WELL), in one implementation.V_(SOURCE) and V_(P-WELL) can differ from one another, or they can becoupled to the same DC voltage, V_(DC). As an example, V_(DC) can beregulated by the voltage regulator 720 to be in the range of about 0.4to 1.2 V, e.g., 0.8 V. Due to the constant voltage on the source andp-well, accurate sensing can be achieved by using just one strobe, asdiscussed previously. Further, all bit line sensing can be performed inwhich storage elements associated with all bit lines are sensed (seeFIG. 14). In particular, the voltage regulator 720 can receive areference voltage, V_(REF,SOURCE) which is used for regulatingV_(SOURCE) to a level greater than 0 V, and a reference voltageV_(REF,P-WELL), which is used for regulating the p-well voltage to alevel greater than or equal to 0 V.

FIG. 7 d depicts a sensing process associated with FIGS. 7 a-7 c. Asense operation, such as a read or verify operation, begins at step 700.Step 702 includes opening the BLS and BLC transistors and pre-chargingthe bit line. Step 704 includes setting the word line voltages. Step 706includes regulating V_(SOURCE) and V_(P-WELL) to positive DC levels.Step 708 includes sensing whether the selected storage element isconductive or non-conductive using current sensing. If there is anothersense operation, at decision step 710, the control flow continues atstep 700. Otherwise, the process ends at step 712.

Further, as discussed previously, sensing can be performed concurrentlyfor multiple storage elements which are associated with a common wordline and source. The multiple storage elements may be in adjacent ornon-adjacent NAND strings. In this case, the sensing includesdetermining, in concurrent sensing operations, whether each of thenon-volatile storage elements is in the conductive or non-conductivestate using current sensing. For each sensing operation, the voltagesare regulated as discussed.

Source Bias All Bit Line Sensing

All bit line sensing involves performing sensing operations on storageelements in adjacent NAND strings (see FIG. 14). One potential sensingapproach uses a DC storage element current to discharge charges on afixed capacitance in a sensing module in a fixed period of time toconvert the storage element's threshold voltage value into a digitaldata format. However, this requires a relatively large current sink intothe source side of the NAND string. Further, as discussed previously,for sensing negative threshold voltage values, a bias can be applied toboth the source and the p-well using an analog voltage level to avoidthe need for negative word line voltages and a negative charge pump.However, since all bit line sensing is very sensitive to the source biaslevel, to maintain the analog voltage level requires a relatively largevoltage regulator and an even distribution of the source voltage intothe array. This can increase the require device area.

Another approach to all bit line sensing uses voltage sensing, discussedpreviously. This approach does not require a large voltage regulatorbecause there is no DC current to the source side. However, thisapproach has not been able to successfully sense every bit line at thesame time due to bit line-to-bit line coupling noise. Instead, onlyevery alternative bit line is sensed at a given time, e.g., in odd-evensensing (see FIG. 14). Therefore, the performance in terms of sensingtime has not been optimal. In particular, all bit line sensing has beenproblematic due to the close proximity of the adjacent NAND strings.Capacitive coupling can occur especially from NAND strings in which theselected storage element is conductive to NAND string in which theselected storage element is non-conductive. The bit line voltage of theNAND string in which the selected storage element is non-conductive isthereby increased, interfering with the sensing operation. Thiscapacitive coupling is depicted by a capacitance to neighboring bitlines 813. The neighboring bit lines/NAND strings can be immediatelyadjacent or non-adjacent. Capacitive coupling from adjacent bitlines/NAND strings is strongest but some capacitively coupling fromnon-adjacent bit lines/NAND strings can also occur. A capacitance toground 811 is also depicted.

To overcome these issues, sensing can be performed using a scheme asdepicted in FIG. 8 a. FIG. 8 a depicts a configuration of a NAND stringand components, including a current discharge path. In a simplifiedexample, a NAND string 812 includes four storage elements which are incommunication with word lines WL0, WL1, WL2 and WL3, respectively. Inpractice, additional storage elements and word lines can be used.Further, additional NAND strings are typically arranged adjacent to oneanother in a block or other set of non-volatile storage elements. Thestorage elements are coupled to a p-well region of a substrate. A bitline 810 having a voltage V_(BL) is depicted, in addition to sensecomponents 800. In particular, a BLS (bit line sense) transistor 806,which is initially open or conductive, is coupled to the bit line 810via a sense node 814. The BLS transistor 806 is a high voltagetransistor, and is made conductive in response to a control 808 duringsense operations. A BLC (bit line control) transistor 804, which isnon-conductive initially, is a low voltage transistor which is opened inresponse to the control 808 to allow the bit line to communicate with avoltage sensing module/circuit 802. During a sense operation, such as aread or verify operation, a pre-charge operation occurs in which acapacitor in the voltage sensing module 602 is charged. The BLCtransistor 804 may be opened to allow the pre-charging.

Further, a relatively weak current pull down device is introduced. Inparticular, a path 816, which is part of a current discharge path forthe NAND string 812, is coupled to the sense node 814, which in turn iscoupled to the bit line 810. A transistor, referred to as GRS transistor818, is provided in a conductive state so that the path 816 is coupledto a path 820, which is also part of the current discharge path. Acurrent source 825, e.g., current mirror, which provides a current ofi_(REF) is provided in parallel to the paths 816, 820 to pull thecurrent i_(CELL) on the paths down to ground. In an example, arelatively weak pull down is provided with an I_(REF) of about 150 nA.However, the strength of the current source 825 can vary according tothe specific implementation.

In one possible configuration, the current source 825 is common tomultiple bit lines and NAND strings. In this case, a transistor 824couples the current source 825 to the different NAND strings. A path 822carries a control signal for the GRS transistor 818, which is local to aparticular bit line and NAND string, while a path 826 is a common groundpath for multiple bit lines.

During sensing, the bit line will charge up to a level which is based onthe threshold voltage of the selected storage element, and a bodyeffect. With a negative Vti, the storage element will be conductive evenwith a V_(GCR)=0 V. V_(P-WELL) may be set to 0 V.

The transistors 818 and 824 are made conductive to create a currentdischarge path and pull down which serves to discharge any charge thatis coupled to the NAND string 812 from one or more neighboring NANDstrings due the capacitance to the neighboring bit line 813. Any extracharge that is generated by a neighboring bit line's coupling noise willtherefore die out eventually. After a certain amount of time, all thebit lines reach their DC levels, and the BLC transistor 804 is turned onto allow charge sharing between the voltage sensing module 802 and thesense node 814 so that voltage sensing of the threshold voltage of theselected storage element can occur. The voltage sensing module 802 mayperform voltage sensing as part of a reading or verifying operation, forinstance.

FIG. 8 b depicts a configuration of the NAND string and components ofFIG. 8 a, when voltage sensing occurs. Here, the BLC transistor 804 isopened so that current flows from the voltage sensing module 802 towardthe discharge path in addition to the current being discharged from theNAND string 812. Thus, the GRS transistor remains in the conductivestate so that discharging continues during the voltage sensing.

FIG. 8 c depicts waveforms associated with FIGS. 8 a and 8 b. V_(SOURCE)is depicted at waveform 830, and voltages on three adjacent bit linesBL0, BL1 and BL2 are depicted at waveforms 832, 834 and 836,respectively. A voltage V_(BLS) on the BLS transistor is depicted atwaveform 838, a voltage V_(BLC) on the BLC transistor is depicted atwaveform 840, and a voltage V_(GRS) on the GRS transistor is depicted atwaveform 842. A sensed voltage on BL0 and BL2 is depicted at waveform844. A sensed voltage on BL1 is depicted at waveform 846 when theselected storage element on BL1 is conductive and at waveform 848 whenthe selected storage element on BL1 is non-conductive. As mentioned,during voltage sensing, charge sharing between the voltage sensingmodule and the bit line occurs when the selected storage element isnon-conductive. This charge sharing lowers the sensed voltage at thevoltage sensing module. Little or no charge sharing between the voltagesensing module and the bit line occurs when the selected storage elementis conductive so that the sensed voltage at the voltage sensing moduleremains high. The sensed voltages at other times are not depicted assensing does not occur.

At t0, V_(BLS) increases so that the BLS transistor is conductive. Att1, V_(SOURCE) is applied as a common source voltage for a set of NANDstrings. In this example, we assume that the selected storage elementassociated with BL1 is non-conductive while the selected storageelements associated with BL0 and BL2 are conductive. BL0 is adjacent toBL1 on one side and BL2 is adjacent to BL1 on the other side (See FIG.14). With the increase in V_(SOURCE) at t1, V_(BL0) and V_(BL2) willrise as depicted by waveforms 832 and 836, respectively, causingcapacitive coupling to BL1, as depicted by the transient increase inV_(BL1). This coupling will substantially die out by t2. The GRStransistor for BL1 remains conductive between t1 and t5 to allow the bitline to discharge the coupled charge, as discussed.

At t3, the BLC transistor is opened by increasing V_(BLC) as depicted bywaveform 840, thereby allowing sensing to occur for the selected storageelement on BL1. Note that corresponding components associated with BL0,BL2 and other bit lines can be controlled similarly to allow sensing tooccur concurrently on those other bit lines. For BL1, the sensed voltageat the voltage sensing module will drop as depicted by waveform 846 ifthe selected storage element is non-conductive. On the other hand, thesensed voltage will remain generally high as depicted by waveform 844 ifthe selected storage element is conductive. The voltage sensingcomponents may use a voltage break point at a specified sense time t4 todetermine whether the selected storage element is conductive ornon-conductive. As mentioned, if the sensed voltage exceeds thebreakpoint, this indicates the storage element is open, while if thesensed voltage drops below the breakpoint, this indicates the storageelement is non-conductive. V_(SOURCE) is lowered at t5 and the BLStransistor is non-conductive at t6, indicating the end of the senseoperation. V_(P-WELL) may be set at 0 V during the sensing, in onepossible approach. The selected word line receives V_(CGR) while theunselected word lines can receive read pass voltages according to theparticular sensing scheme.

Thus, after the source voltage is applied at t1, a predetermine delay ofduration t3-t1 is instituted to allow sufficient time for the capacitivecoupling from neighboring bit lines to be fully or at least partlydischarged. The appropriate delay can be set as required for particularimplementations based on theoretical and/or experimental tests. Afterthe delay, voltage sensing occurs. At the specified time t4, adetermination is made as to whether the storage element is in aconductive or non-conductive state and, therefore, has a thresholdvoltage which is below or above, respectively, a verify or read comparelevel.

FIG. 8 d depicts a sensing process associated with FIGS. 8 a-8 c. Atstep 850, a sense operation begins. At step 852, the BLS transistor isopened while the BLC transistor remains non-conductive, and the bit lineis pre-charged. At step 854, the word line voltages are set. At step856, V_(SOURCE) and V_(P-WELL) are set (V_(P-WELL)=0 V). At step 858,bit line discharges. At step 860, the BLC transistor is made conductiveto allow sensing to occur. At step 862, a determination is made as towhether the selected storage element is conductive or non-conductiveusing voltage sensing. If there is another sense operation, at decisionstep 864, the control flow continues at step 850. Otherwise, the processends at step 868.

Further, as discussed previously, sensing can be performed concurrentlyfor multiple storage elements which are associated with a common wordline and source. The multiple storage elements may be in adjacent ornon-adjacent NAND strings. In this case, the sensing includesdetermining, in concurrent sensing operations, whether each of thenon-volatile storage elements is in the conductive or non-conductivestate using current sensing. The delay before the BLC transistor isopened can be instituted for each NAND string so that the NAND stringscan discharge as needed before sensing occurs.

Temperature Compensating Bit Line During Sense Operations

In present non-volatile storage devices, such as NAND flash memorydevices, temperature variations present various issues in reading andwriting data. A memory device is subject to varying temperatures basedon the environment in which it is located. For example, some currentmemory devices are rated for use between −40° C. and +85° C. Devices inindustrial, military and even consumer applications may experiencesignificant temperature variations. Temperature affects many transistorparameters, the dominant among which is the threshold voltage. Inparticular, temperature variations can cause read errors and widen thethreshold voltage distributions of the different states of anon-volatile storage element. An improved technique for addressingtemperature effects in non-volatile storage devices is discussed below.

FIG. 9 a depicts a NAND string and components fortemperature-compensated sensing. Like numbered components correspond tothose provided in FIG. 8 a. The current discharge path of FIG. 8 a isnot depicted here. However, it is possible for the configuration of FIG.8 a to be combined with the configuration of FIG. 9 a or some of theother figures provided herein. In addition, a temperature-dependentcircuit 900 is provided as part of the control 808 to provide atemperature compensated voltage to the BLC transistor 804. The BLCtransistor 804 has one node which is coupled to the voltage sensingmodule 802 and another node which is coupled to a drain or bit linewhich is associated with the NAND string 812 or other set ofnon-volatile storage elements.

During a sense operation, a voltage V_(BLC) is applied to the BLCtransistor 600, which couples the bit line or drain side of the NANDstring 812 to the voltage sense module 802. In accordance with theapproach herein, V_(BLC) is set based on temperature to cancel out, orcompensate for, variations in V_(BL) with temperature. Specifically,V_(BLC)=V_(BL)+V_(TH) (temperature-independent)++ΔV, where ΔV is avoltage change due to temperature. V_(BL) is also changed by ΔV due totemperature. Thus, V_(BLC) can be controlled so that it varies withtemperature in accordance with the variations in V_(BL). In particular,ΔV on the bit line can be matched to the ΔV of V_(BLC) by using thetemperature-dependent circuit 900. A current i_(CELL) flows in the NANDstring 812. The dotted line denotes charge sharing.

FIG. 9 b illustrates a threshold voltage change with temperature, e.g.,ΔV_(TH)/° C. Typically, the threshold voltage of a non-volatile storageelement decreases as temperature increases. The change in voltagerelative to the change in temperature can be expressed in terms of atemperature coefficient which is typically about −2 mV/° C. Thetemperature coefficient depends on various characteristics of the memorydevice, such as doping, layout and so forth. Moreover, the temperaturecoefficient is expected to increase in magnitude as memory dimensionsare reduced.

Various techniques are known for providing temperature-compensatedsignals generally. One or more of these techniques can be used in thetemperature-dependent circuit 900, for instance. Most of thesetechniques do not rely on obtaining an actual temperature measurement,although this approach is also possible. For example, U.S. Pat. No.6,801,454, titled “Voltage Generation Circuitry Having TemperatureCompensation,” incorporated herein by reference, describes a voltagegeneration circuit which outputs read voltages to a non-volatile memorybased on a temperature coefficient. The circuit uses a band gap currentwhich includes a temperature-independent portion and atemperature-dependent portion which increases as temperature increases.U.S. Pat. No. 6,560,152, titled “Non-Volatile Memory WithTemperature-Compensated Data Read”, incorporated herein by reference,uses a bias generator circuit which biases a voltage which is applied toa source or drain of a data storage element. U.S. Pat. No. 5,172,338,titled “Multi-State EEPROM Read and Write Circuits and Techniques”,incorporated herein by reference, describes a temperature-compensationtechnique which uses reference storage cells that are formed in the samemanner as data storage cells and on the same integrated circuit chip.The reference storage cells provide reference levels against whichmeasured currents or voltages of the selected cells are compared.Temperature compensation is provided since the reference levels areaffected by temperature in the same manner as the values read from thedata storage cells. Any of the these techniques, as well as any otherknown techniques, can be used to provide a temperature-compensatedvoltage to a bit line control line as described herein.

V_(BLC), as discussed, is a voltage of a control signal or voltageprovided to the BLC transistor 804, which allows a sense component tosense the V_(TH) of a selected storage element which is undergoing anerase-verify or other sensing operation. The sensing occurs via a bitline of a NAND string in which the selected storage element is located.In an example implementation, V_(BLC)=V_(BL)+V_(TH) (BLC transistor).Thus, the control is configured to increase V_(BLC) with increasingtemperature to track the increase in V_(BL). For a given V_(TH) of astorage element, V_(BL) will increase with temperature.

FIG. 9 c illustrates a change in V_(BLC) and V_(BL) with temperature.The figure depicts how V_(BLC) is increased with temperature to trackthe increase in V_(BL). A control curve which provides specific changesin V_(BLC) versus temperature can be programmed into the control 808according to the specific implementation based on theoretical andexperimental results. Generally, as the V_(TH) of a storage elementdecreases with higher temperatures, the bit line voltage increases. Thismeans V_(BLC) should be higher in order for the voltage sensing module802 to sense the higher V_(BL). Note that the V_(TH) of the storageelement dictates V_(BL). However, changing V_(BLC) changes the voltagethat the voltage sensing module senses so that the voltage istemperature compensated. Further, note that changes in the V_(TH) of theBLC transistor 804 can be cancelled out by providing a transistor in thetemperature-dependent circuit 900 which varies with temperature similarto the BLC transistor 804.

FIG. 9 d depicts waveforms associated with FIGS. 9 a-c. Waveform 910depicts V_(SOURCE) and V_(P-WELL), which are set at an elevated level att1 during the sense operation. Waveforms 912 and 914 depict an increasein V_(BL) due to the application of V_(SOURCE) and V_(P-WELL). Thehigher level of V_(BL) at a higher temperature is depicted by waveform912 versus waveform 914. In practice, after rising, V_(BL) may dropslightly (not shown) when current flows in the NAND string. Waveform 916depicts a voltage applied to transistor BLS, indicating that it isturned on at t0. Waveforms 918 and 920 depict voltages applied totransistor BLC at higher and lower temperatures, respectively. Note thatthe waveforms provided are for the temperature compensation scheme incombination with the scheme of FIGS. 8 a-d, where the opening of the BLCtransistor is delayed to allow discharging to occur before sensing.However, the temperature compensation scheme is not required to be usedin this way, and may be used in other implementations which do notinvolve a discharge path and/or a delay in sensing.

Waveform 922 depicts a sensed voltage in the voltage sensing module forthe selected bit line when the selected storage element is open, whilewaveform 924 depicts a sensed voltage when the selected storage elementis non-conductive. A determination can be made at t2 as to whether thesensed voltage exceeds a breakpoint. It can be concluded that theselected storage element is conductive or non-conductive when the sensedvoltage exceeds the breakpoint or falls below the breakpoint,respectively.

FIG. 9 e depicts a sensing process associated with FIGS. 9 a-d. A senseoperation, such as a read or verify operation, begins at step 930. Step932 includes making the BLS and BLC transistors conductive, pre-chargingthe bit line, and setting a temperature dependent V_(BLC). Step 934includes setting the word line voltages, which are optionallytemperature dependent. In one approach, only the selected word linevoltage is temperature-dependent while in other approaches some or allof the word line voltages are temperature dependent. The word linevoltages can be decreased with increasing temperatures in accordancewith the decrease in V_(TH) (See FIG. 9 b). Step 936 includes settingV_(SOURCE) and V_(P-WELL). Step 938 includes determining whether theselected storage element is conductive or non-conductive using voltagesensing. If another sense operation is to be performed, at decision step940, the control flow continues at step 930. Otherwise, the process endsat step 942.

Note that the drain or bit line of a NAND string communicates with thedrain of the selected storage element since the storage elements on thedrain side of the selected storage element are in a conductive state dueto the sufficiently high voltages on the associated word lines.Similarly, the source of a NAND string communicates with the source ofthe selected storage element since the storage elements on the sourceside of the selected storage element are in a conductive state due tothe sufficiently high voltages on the associated word lines. Thus, avoltage of the drain or bit line of a NAND string is also essentiallythe voltage of the drain of the selected storage element, and a voltageof the source of a NAND string is also essentially the voltage of thesource of the selected storage element. Also, it is not necessary forthe storage element being sensed to be in a NAND string or other set ofstorage elements as the technique described herein can be used with asingle storage element.

Further, as discussed previously, sensing can be performed concurrentlyfor multiple storage elements which are associated with a common wordline and source.

Moreover, from the perspective of the control 808, the sensing processinvolves receiving information from the temperature-dependent circuit900, and, responsive to the information, providing atemperature-compensated voltage to a control gate of the BLC transistor,which couples a NAND string or other set of non-volatile storageelements to a sense circuit. The control can also set the word line,source and p-well voltages, as well as receive information from thevoltage sensing module 802 regarding the sensed programming condition ofthe selected storage element.

FIG. 9 f depicts an erase-verify process. Step 950 includes erasing aset of storage elements. Step 952 includes beginning soft programming ofone or more of the storage elements to a desired erase state, forinstance. Soft programming generally involved applying voltage pulses tothe selected word line to raise the threshold voltage of one or more thestorage elements on the selected word line. The voltage pulses may besoft programming pulses which are lower in amplitude than those used forprogramming to higher states (step 954). This type of programming may beused, e.g., when the storage elements undergo a deep erase to ensurethat their threshold voltages are all below the threshold voltage of thedesired erased state. Step 956 includes verifying a programmingcondition of the storage elements, e.g., relative to the desired erasedstate. For example, this can include performing steps 932-938 of FIG. 9e, discussed above. If the soft programming is to be continued, atdecision step 958, e.g., when the storage element has not reached thedesired erase state, the control flow continues at step 954. Otherwise,the process ends at step 960.

Further, the erase-verify operation can be performed concurrently formultiple storage elements which are associated with a common word lineand source.

FIG. 10 a illustrates a change in V_(SOURCE) with temperature. Inanother approach, V_(SOURCE) is temperature compensated, e.g., so thatit increases with temperature. Generally, V_(WL)=V_(SOURCE)+V_(TH)(selected storage element), where V_(WL) is the voltage applied to theselected word line. As discussed, V_(TH) decreases with temperature.Thus, with V_(WL) fixed, V_(SOURCE) can be set to increase withtemperature to avoid temperature biases during sensing. Further, in onepossible implementation, a constraint may be placed so that V_(SOURCE)is increased only to positive values. For example, if V_(SOURCE)=0 V ata baseline temperature, and the temperature increases, V_(SOURCE)remains at 0 V. If the temperature decreases, V_(SOURCE) increasesaccording to the temperature coefficient. On the other hand, ifV_(SOURCE)>0 V at a baseline temperature, and the temperature increases,V_(SOURCE) can decrease to a value which is greater than or equal to 0V, i.e., a non-negative value. If the temperature decreases, V_(SOURCE)increases according to the temperature coefficient.

FIG. 10 b depicts an example of an array of storage elements, includingdifferent sets of NAND strings. Along each column of a memory array1000, a bit line 1006 is coupled to the drain terminal 1026 of the drainselect gate for the NAND string 1050. Along each row of NAND strings, asource line 1004 may connect all the source terminals 1028 of the sourceselect gates of the NAND strings. An example of a NAND architecturearray and its operation as part of a memory system is found in U.S. Pat.Nos. 5,570,315; 5,774,397; and 6,046,935.

The array of storage elements is divided into a large number of blocksof storage elements. As is common for flash EEPROM systems, the block isthe unit of erase. That is, each block contains the minimum number ofstorage elements that are erased together. Each block is typicallydivided into a number of pages. A page is a unit of programming. In oneembodiment, the individual pages may be divided into segments and thesegments may contain the fewest number of storage elements that arewritten at one time as a basic programming operation. One or more pagesof data are typically stored in one row of storage elements. A page canstore one or more sectors. A sector includes user data and overheaddata. Overhead data typically includes an Error Correction Code (ECC)that has been calculated from the user data of the sector. A portion ofthe controller (described below) calculates the ECC when data is beingprogrammed into the array, and also checks it when data is being readfrom the array. Alternatively, the ECCs and/or other overhead data arestored in different pages, or even different blocks, than the user datato which they pertain.

A sector of user data is typically 512 bytes, corresponding to the sizeof a sector in magnetic disk drives. Overhead data is typically anadditional 16-20 bytes. A large number of pages form a block, anywherefrom 8 pages, for example, up to 32, 64, 128 or more pages. In someembodiments, a row of NAND strings comprises a block.

Memory storage elements are erased in one embodiment by raising thep-well to an erase voltage (e.g., 20 V) for a sufficient period of timeand grounding the word lines of a selected block while the source andbit lines are floating. Due to capacitive coupling, the unselected wordlines, bit lines, select lines, and c-source are also raised to asignificant fraction of the erase voltage. A strong electric field isthus applied to the tunnel oxide layers of selected storage elements andthe data of the selected storage elements are erased as electrons of thefloating gates are emitted to the substrate side, typically byFowler-Nordheim tunneling mechanism. As electrons are transferred fromthe floating gate to the p-well region, the threshold voltage of aselected storage element is lowered. Erasing can be performed on theentire memory array, separate blocks, or another unit of storageelements.

FIG. 11 is a block diagram of a non-volatile memory system using singlerow/column decoders and read/write circuits. The diagram illustrates amemory device 1196 having read/write circuits for reading andprogramming a page of storage elements in parallel, according to oneembodiment of the present invention. Memory device 1196 may include oneor more memory die 1198. Memory die 1198 includes a two-dimensionalarray of storage elements 1000, control circuitry 1110, and read/writecircuits 1165. In some embodiments, the array of storage elements can bethree dimensional. The memory array 1000 is addressable by word linesvia a row decoder 1130 and by bit lines via a column decoder 1160. Theread/write circuits 1165 include multiple sense blocks 1100 and allow apage of storage elements to be read or programmed in parallel. Typicallya controller 1150 is included in the same memory device 1196 (e.g., aremovable storage card) as the one or more memory die 1198. Commands andData are transferred between the host and controller 1150 via lines 1120and between the controller and the one or more memory die 1198 via lines1118.

The control circuitry 1110 cooperates with the read/write circuits 1165to perform memory operations on the memory array 1000. The controlcircuitry 1110 includes a state machine 1112, an on-chip address decoder1114 and a power control module 1116. The state machine 1112 provideschip-level control of memory operations. The on-chip address decoder1114 provides an address interface between that used by the host or amemory controller to the hardware address used by the decoders 1130 and1160. The power control module 1116 controls the power and voltagessupplied to the word lines and bit lines during memory operations.

In some implementations, some of the components of FIG. 11 can becombined. In various designs, one or more of the components (alone or incombination), other than storage element array 1000, can be thought ofas a managing or control circuit. For example, one or more managing orcontrol circuits may include any one of or a combination of controlcircuitry 1110, state machine 1112, decoders 1114/1160, power control1116, sense blocks 1100, read/write circuits 1165, controller 1150, etc.

FIG. 12 is a block diagram of a non-volatile memory system using dualrow/column decoders and read/write circuits. Here, another arrangementof the memory device 1196 shown in FIG. 11 is provided. Access to thememory array 1000 by the various peripheral circuits is implemented in asymmetric fashion, on opposite sides of the array, so that the densitiesof access lines and circuitry on each side are reduced by half. Thus,the row decoder is split into row decoders 1130A and 1130B and thecolumn decoder into column decoders 1160A and 1160B. Similarly, theread/write circuits are split into read/write circuits 1165A connectingto bit lines from the bottom and read/write circuits 1165B connecting tobit lines from the top of the array 1000. In this way, the density ofthe read/write modules is essentially reduced by one half. The device ofFIG. 12 can also include a controller, as described above for the deviceof FIG. 11.

FIG. 13 is a block diagram depicting one embodiment of a sense block. Anindividual sense block 1100 is partitioned into a core portion, referredto as a sense module 1180, and a common portion 1190. In one embodiment,there will be a separate sense module 1180 for each bit line and onecommon portion 1190 for a set of multiple sense modules 1180. In oneexample, a sense block will include one common portion 1190 and eightsense modules 1180. Each of the sense modules in a group willcommunicate with the associated common portion via a data bus 1172. Forfurther details refer to U.S. Patent Application Pub No. 2006/0140007,titled “Non-Volatile Memory and Method with Shared Processing for anAggregate of Sense Amplifiers” published Jun. 29, 2006, and incorporatedherein by reference in its entirety.

Sense module 1180 comprises sense circuitry 1170 that determines whethera conduction current in a connected bit line is above or below apredetermined threshold level. Sense module 1180 also includes a bitline latch 1182 that is used to set a voltage condition on the connectedbit line. For example, a predetermined state latched in bit line latch1182 will result in the connected bit line being pulled to a statedesignating program inhibit (e.g., V_(DD)).

Common portion 1190 comprises a processor 1192, a set of data latches1194 and an I/O Interface 1196 coupled between the set of data latches1194 and data bus 1120. Processor 1192 performs computations. Forexample, one of its functions is to determine the data stored in thesensed storage element and store the determined data in the set of datalatches. The set of data latches 1194 is used to store data bitsdetermined by processor 1192 during a read operation. It is also used tostore data bits imported from the data bus 1120 during a programoperation. The imported data bits represent write data meant to beprogrammed into the memory. I/O interface 1196 provides an interfacebetween data latches 1194 and the data bus 1120.

During read or sensing, the operation of the system is under the controlof state machine 1112 that controls the supply of different control gatevoltages to the addressed storage element. As it steps through thevarious predefined control gate voltages corresponding to the variousmemory states supported by the memory, the sense module 1180 may trip atone of these voltages and an output will be provided from sense module1180 to processor 1192 via bus 1172. At that point, processor 1192determines the resultant memory state by consideration of the trippingevent(s) of the sense module and the information about the appliedcontrol gate voltage from the state machine via input lines 1193. Itthen computes a binary encoding for the memory state and stores theresultant data bits into data latches 1194. In another embodiment of thecore portion, bit line latch 1182 serves double duty, both as a latchfor latching the output of the sense module 1180 and also as a bit linelatch as described above.

Some implementations can include multiple processors 1192. In oneembodiment, each processor 1192 will include an output line (notdepicted) such that each of the output lines is wired-OR'd together. Insome embodiments, the output lines are inverted prior to being connectedto the wired-OR line. This configuration enables a quick determinationduring the program verification process of when the programming processhas completed because the state machine receiving the wired-OR candetermine when all bits being programmed have reached the desired level.For example, when each bit has reached its desired level, a logic zerofor that bit will be sent to the wired-OR line (or a data one isinverted). When all bits output a data 0 (or a data one inverted), thenthe state machine knows to terminate the programming process. Becauseeach processor communicates with eight sense modules, the state machineneeds to read the wired-OR line eight times, or logic is added toprocessor 1192 to accumulate the results of the associated bit linessuch that the state machine need only read the wired-OR line one time.Similarly, by choosing the logic levels correctly, the global statemachine can detect when the first bit changes its state and change thealgorithms accordingly.

During program or verify, the data to be programmed is stored in the setof data latches 1194 from the data bus 1120. The program operation,under the control of the state machine, comprises a series ofprogramming voltage pulses applied to the control gates of the addressedstorage elements. Each programming pulse is followed by a read back(verify) to determine if the storage element has been programmed to thedesired memory state. Processor 1192 monitors the read back memory staterelative to the desired memory state. When the two are in agreement, theprocessor 1192 sets the bit line latch 1182 so as to cause the bit lineto be pulled to a state designating program inhibit. This inhibits thestorage element coupled to the bit line from further programming even ifprogramming pulses appear on its control gate. In other embodiments theprocessor initially loads the bit line latch 1182 and the sensecircuitry sets it to an inhibit value during the verify process.

Data latch stack 1194 contains a stack of data latches corresponding tothe sense module. In one embodiment, there are three data latches persense module 1180. In some implementations (but not required), the datalatches are implemented as a shift register so that the parallel datastored therein is converted to serial data for data bus 1120, and viceversa. In the preferred embodiment, all the data latches correspondingto the read/write block of m storage elements can be linked together toform a block shift register so that a block of data can be input oroutput by serial transfer. In particular, the bank of r read/writemodules is adapted so that each of its set of data latches will shiftdata in to or out of the data bus in sequence as if they are part of ashift register for the entire read/write block.

Additional information about the structure and/or operations of variousembodiments of non-volatile storage devices can be found in (1) U.S.Pat. No. 7,196,931, issued Mar. 27, 2007, titled “Non-Volatile MemoryAnd Method With Reduced Source Line Bias Errors”; (2) U.S. Pat. No.7,023,736, issued Apr. 4, 2006, titled “Non-Volatile Memory And Methodwith Improved Sensing”; (3) U.S. Pat. No. 7,046,568, issued May 16,2006, titled “Memory Sensing Circuit And Method For Low VoltageOperation”; (4) U.S. Patent Application Pub. 2006/0221692, publishedOct. 5, 2006, titled “Compensating for Coupling During Read Operationsof Non-Volatile Memory”; and (5) U.S. Patent Application Pub. No.2006/0158947, published Jul. 20, 2006, titled “Reference Sense AmplifierFor Non-Volatile Memory.” All five of the immediately above-listedpatent documents are incorporated herein by reference in their entirety.

FIG. 14 illustrates an example of an organization of a memory array intoblocks for an all bit line memory architecture or for an odd-even memoryarchitecture. Exemplary structures of memory array 1400 are described.As one example, a NAND flash EEPROM is described that is partitionedinto 1,024 blocks. The data stored in each block can be simultaneouslyerased. In one embodiment, the block is the minimum unit of storageelements that are simultaneously erased. In each block, in this example,there are 8,512 columns corresponding to bit lines BL0, BL1, . . .BL8511. In one embodiment referred to as an all bit line (ABL)architecture (architecture 1410), all the bit lines of a block can besimultaneously selected during read and program operations. Storageelements along a common word line and connected to any bit line can beprogrammed at the same time.

In the example provided, 64 storage elements and two dummy storageelements are connected in series to form a NAND string. There are sixtyfour data word lines and two dummy word lines, WL-d0 and WL-d1, whereeach NAND string includes sixty four data storage elements and two dummystorage elements. In other embodiments, the NAND strings can have moreor less than 64 data storage elements and two dummy storage elements.Data memory cells can store user or system data. Dummy memory cells aretypically not used to store user or system data.

One terminal of the NAND string is connected to a corresponding bit linevia a drain select gate (connected to select gate drain lines SGD), andanother terminal is connected to c-source via a source select gate(connected to select gate source line SGS).

In one embodiment, referred to as an odd-even architecture (architecture1400), the bit lines are divided into even bit lines (BLe) and odd bitlines (BLo). In this case, storage elements along a common word line andconnected to the odd bit lines are programmed at one time, while storageelements along a common word line and connected to even bit lines areprogrammed at another time. Data can be programmed into different blocksand read from different blocks concurrently. In each block, in thisexample, there are 8,512 columns that are divided into even columns andodd columns.

During one configuration of read and programming operations, 4,256storage elements are simultaneously selected. The storage elementsselected have the same word line and the same kind of bit line (e.g.,even or odd). Therefore, 532 bytes of data, which form a logical page,can be read or programmed simultaneously, and one block of the memorycan store at least eight logical pages (four word lines, each with oddand even pages). For multi-state storage elements, when each storageelement stores two bits of data, where each of these two bits are storedin a different page, one block stores sixteen logical pages. Other sizedblocks and pages can also be used.

For either the ABL or the odd-even architecture, storage elements can beerased by raising the p-well to an erase voltage (e.g., 20 V) andgrounding the word lines of a selected block. The source and bit linesare floating. Erasing can be performed on the entire memory array,separate blocks, or another unit of the storage elements which is aportion of the memory device. Electrons are transferred from thefloating gates of the storage elements to the p-well region so that theV_(TH) of the storage elements becomes negative.

FIG. 15 depicts an example set of threshold voltage distributions.Example V_(TH) distributions for the storage element array are providedfor a case where each storage element stores two bits of data. A firstthreshold voltage distribution E is provided for erased storageelements. Three threshold voltage distributions, A, B and C forprogrammed storage elements, are also depicted. In one embodiment, thethreshold voltages in the E distribution are negative and the thresholdvoltages in the A, B and C distributions are positive.

Each distinct threshold voltage range corresponds to predeterminedvalues for the set of data bits. The specific relationship between thedata programmed into the storage element and the threshold voltagelevels of the storage element depends upon the data encoding schemeadopted for the storage elements. For example, U.S. Pat. No. 6,222,762and U.S. Patent Application Publication No. 2004/0255090, published Dec.16, 2004, both of which are incorporated herein by reference in theirentirety, describe various data encoding schemes for multi-state flashstorage elements. In one embodiment, data values are assigned to thethreshold voltage ranges using a Gray code assignment so that if thethreshold voltage of a floating gate erroneously shifts to itsneighboring physical state, only one bit will be affected. One exampleassigns “11” to threshold voltage range E (state E), “10” to thresholdvoltage range A (state A), “00” to threshold voltage range B (state B)and “01” to threshold voltage range C (state C). However, in otherembodiments, Gray code is not used. Although four states are shown, thepresent invention can also be used with other multi-state structuresincluding those that include more or fewer than four states.

Three read reference voltages, Vra, Vrb and Vrc, are also provided forreading data from storage elements. By testing whether the thresholdvoltage of a given storage element is above or below Vra, Vrb and Vrc,the system can determine the state, e.g., programming condition, thestorage element is in.

Further, three verify reference voltages, Vva, Vvb and Vvc, areprovided. Additional read and reference values can be used when thestorage elements store additional states. When programming storageelements to state A, the system will test whether those storage elementshave a threshold voltage greater than or equal to Vva. When programmingstorage elements to state B, the system will test whether the storageelements have threshold voltages greater than or equal to Vvb. Whenprogramming storage elements to state C, the system will determinewhether storage elements have their threshold voltage greater than orequal to Vvc.

In one embodiment, known as full sequence programming, storage elementscan be programmed from the erase state E directly to any of theprogrammed states A, B or C. For example, a population of storageelements to be programmed may first be erased so that all storageelements in the population are in erased state E. A series ofprogramming pulses such as depicted by the control gate voltage sequenceof FIG. 19 will then be used to program storage elements directly intostates A, B or C. While some storage elements are being programmed fromstate E to state A, other storage elements are being programmed fromstate E to state B and/or from state E to state C. When programming fromstate E to state C on a selected word line, WLi, the amount of parasiticcoupling to the adjacent floating gate under WLi-1 is a maximized sincethe change in amount of charge on the floating gate under WLi is largestas compared to the change in voltage when programming from state E tostate A or state E to state B. When programming from state E to state Bthe amount of coupling to the adjacent floating gate is reduced butstill significant. When programming from state E to state A the amountof coupling is reduced even further. Consequently the amount ofcorrection required to subsequently read each state of WLi-1 will varydepending on the state of the adjacent storage element on WLi.

FIG. 16 illustrates an example of a two-pass technique of programming amulti-state storage element that stores data for two different pages: alower page and an upper page. Four states are depicted: state E (11),state A (10), state B (00) and state C (01). For state E, both pagesstore a “1.” For state A, the lower page stores a “0” and the upper pagestores a “1.” For state B, both pages store “0.” For state C, the lowerpage stores “1” and the upper page stores “0.” Note that althoughspecific bit patterns have been assigned to each of the states,different bit patterns may also be assigned.

In a first programming pass, the storage element's threshold voltagelevel is set according to the bit to be programmed into the lowerlogical page. If that bit is a logic “1,” the threshold voltage is notchanged since it is in the appropriate state as a result of having beenearlier erased. However, if the bit to be programmed is a logic “0,” thethreshold level of the storage element is increased to be state A, asshown by arrow 1600. That concludes the first programming pass.

In a second programming pass, the storage element's threshold voltagelevel is set according to the bit being programmed into the upperlogical page. If the upper logical page bit is to store a logic “1,”then no programming occurs since the storage element is in one of thestates E or A, depending upon the programming of the lower page bit,both of which carry an upper page bit of “1.” If the upper page bit isto be a logic “0,” then the threshold voltage is shifted. If the firstpass resulted in the storage element remaining in the erased state E,then in the second phase the storage element is programmed so that thethreshold voltage is increased to be within state C, as depicted byarrow 1620. If the storage element had been programmed into state A as aresult of the first programming pass, then the storage element isfurther programmed in the second pass so that the threshold voltage isincreased to be within state B, as depicted by arrow 1610. The result ofthe second pass is to program the storage element into the statedesignated to store a logic “0” for the upper page without changing thedata for the lower page. In both FIG. 15 and FIG. 16, the amount ofcoupling to the floating gate on the adjacent word line depends on thefinal state.

In one embodiment, a system can be set up to perform full sequencewriting if enough data is written to fill up an entire page. If notenough data is written for a full page, then the programming process canprogram the lower page programming with the data received. Whensubsequent data is received, the system will then program the upperpage. In yet another embodiment, the system can start writing in themode that programs the lower page and convert to full sequenceprogramming mode if enough data is subsequently received to fill up anentire (or most of a) word line's storage elements. More details of suchan embodiment are disclosed in U.S. Patent Application Pub. No.2006/0126390, titled “Pipelined Programming of Non-Volatile MemoriesUsing Early Data,” published Jun. 15, 2006, incorporated herein byreference in its entirety.

FIGS. 17 a-c disclose another process for programming non-volatilememory that reduces the effect of floating gate to floating gatecoupling by, for any particular storage element, writing to thatparticular storage element with respect to a particular page subsequentto writing to adjacent storage elements for previous pages. In oneexample implementation, the non-volatile storage elements store two bitsof data per storage element, using four data states. For example, assumethat state E is the erased state and states A, B and C are theprogrammed states. State E stores data 11. State A stores data 01. StateB stores data 10. State C stores data 00. This is an example of non-Graycoding because both bits change between adjacent states A and B. Otherencodings of data to physical data states can also be used. Each storageelement stores two pages of data. For reference purposes, these pages ofdata will be called upper page and lower page; however, they can begiven other labels. With reference to state A, the upper page stores bit0 and the lower page stores bit 1. With reference to state B, the upperpage stores bit 1 and the lower page stores bit 0. With reference tostate C, both pages store bit data 0.

The programming process is a two-step process. In the first step, thelower page is programmed. If the lower page is to remain data 1, thenthe storage element state remains at state E. If the data is to beprogrammed to 0, then the threshold of voltage of the storage element israised such that the storage element is programmed to state B′. FIG. 17a therefore shows the programming of storage elements from state E tostate B′. State B′ is an interim state B; therefore, the verify point isdepicted as Vvb′, which is lower than Vvb.

In one embodiment, after a storage element is programmed from state E tostate B′, its neighbor storage element (WLn+1) in the NAND string willthen be programmed with respect to its lower page. For example, lookingback at FIG. 2, after the lower page for storage element 106 isprogrammed, the lower page for storage element 104 would be programmed.After programming storage element 104, the floating gate to floatinggate coupling effect will raise the apparent threshold voltage ofstorage element 106 if storage element 104 had a threshold voltageraised from state E to state B′. This will have the effect of wideningthe threshold voltage distribution for state B′ to that depicted asthreshold voltage distribution 1750 of FIG. 17 b. This apparent wideningof the threshold voltage distribution will be remedied when programmingthe upper page.

FIG. 17 c depicts the process of programming the upper page. If thestorage element is in erased state E and the upper page is to remain at1, then the storage element will remain in state E. If the storageelement is in state E and its upper page data is to be programmed to 0,then the threshold voltage of the storage element will be raised so thatthe storage element is in state A. If the storage element was inintermediate threshold voltage distribution 1750 and the upper page datais to remain at 1, then the storage element will be programmed to finalstate B. If the storage element is in intermediate threshold voltagedistribution 1750 and the upper page data is to become data 0, then thethreshold voltage of the storage element will be raised so that thestorage element is in state C. The process depicted by FIGS. 17 a-creduces the effect of floating gate to floating gate coupling becauseonly the upper page programming of neighbor storage elements will havean effect on the apparent threshold voltage of a given storage element.An example of an alternate state coding is to move from distribution1750 to state C when the upper page data is a 1, and to move to state Bwhen the upper page data is a 0.

Although FIGS. 17 a-c provide an example with respect to four datastates and two pages of data, the concepts taught can be applied toother implementations with more or fewer than four states and differentthan two pages. For example, FIGS. 5 a-d discussed an embodiment withthree pages: lower, middle and upper.

FIG. 18 is a flow chart describing one embodiment of a method forprogramming non-volatile memory. In one implementation, storage elementsare erased (in blocks or other units) prior to programming. In step1800, a “data load” command is issued by the controller and inputreceived by control circuitry 1110. In step 1805, address datadesignating the page address is input to decoder 1114 from thecontroller or host. In step 1810, a page of program data for theaddressed page is input to a data buffer for programming. That data islatched in the appropriate set of latches. In step 1815, a “program”command is issued by the controller to state machine 1112.

Triggered by the “program” command, the data latched in step 1810 willbe programmed into the selected storage elements controlled by statemachine 1112 using the stepped program pulses of the pulse train 1900 ofFIG. 19 applied to the appropriate selected word line. In step 1820, theprogram voltage, V_(PGM), is initialized to the starting pulse (e.g., 12V or other value) and a program counter (PC) maintained by state machine1112 is initialized at zero. In step 1830, the first V_(PGM) pulse isapplied to the selected word line to begin programming storage elementsassociated with the selected word line. If logic “0” is stored in aparticular data latch indicating that the corresponding storage elementshould be programmed, then the corresponding bit line is grounded. Onthe other hand, if logic “1” is stored in the particular latchindicating that the corresponding storage element should remain in itscurrent data state, then the corresponding bit line is connected toV_(dd) to inhibit programming.

In step 1835, the states of the selected storage elements are verified.If it is detected that the target threshold voltage of a selectedstorage element has reached the appropriate level, then the data storedin the corresponding data latch is changed to a logic “1.” If it isdetected that the threshold voltage has not reached the appropriatelevel, the data stored in the corresponding data latch is not changed.In this manner, a bit line having a logic “1” stored in itscorresponding data latch does not need to be programmed. When all of thedata latches are storing logic “1,” the state machine (via the wired-ORtype mechanism described above) knows that all selected storage elementshave been programmed. In step 1840, a check is made as to whether all ofthe data latches are storing logic “1.” If all of the data latches arestoring logic “1,” the programming process is complete and successfulbecause all selected storage elements were programmed and verified. Astatus of “PASS” is reported in step 1845.

If, in step 1840, it is determined that not all of the data latches arestoring logic “1,” then the programming process continues. In step 1850,the program counter PC is checked against a program limit value PCmax.One example of a program limit value is twenty; however, other numberscan also be used. If the program counter PC is not less than PCmax, thenthe program process has failed and a status of “FAIL” is reported instep 1855. If the program counter PC is less than PCmax, then V_(PGM) isincreased by the step size and the program counter PC is incremented instep 1860. The process then loops back to step 1830 to apply the nextV_(PGM) pulse.

FIG. 19 depicts an example pulse train 1900 applied to the control gatesof non-volatile storage elements during programming, and a switch inboost mode which occurs during a pulse train. The pulse train 1900includes a series of program pulses 1905, 1910, 1915, 1920, 1925, 1930,1935, 1940, 1945, 1950, . . . , that are applied to a word line selectedfor programming. In one embodiment, the programming pulses have avoltage, V_(PGM), which starts at 12 V and increases by increments,e.g., 0.5 V, for each successive programming pulse until a maximum of 20V is reached. In between the program pulses are verify pulses. Forexample, verify pulse set 1906 includes three verify pulses. In someembodiments, there can be a verify pulse for each state that data isbeing programmed into, e.g., state A, B and C. In other embodiments,there can be more or fewer verify pulses. The verify pulses in each setcan have amplitudes of Vva, Vvb and Vvc (FIG. 16) or Vvb′ (FIG. 17 a),for instance.

As mentioned, the voltages which are applied to word lines to implementa boost mode are applied when programming occurs, e.g., prior to andduring a program pulse. In practice, the boost voltages of a boost modecan be initiated slightly before each program pulse and removed aftereach program pulse. On the other hand, during the verify process, forinstance, which occurs between program pulses, the boost voltages arenot applied. Instead, read voltages, which are typically less than theboost voltages, are applied to the unselected word lines. The readvoltages have an amplitude which is sufficient to maintain thepreviously programmed storage elements in a NAND string on when thethreshold voltage of a currently-programmed storage element is beingcompared to a verify level.

The foregoing detailed description of the invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed. Manymodifications and variations are possible in light of the aboveteaching. The described embodiments were chosen in order to best explainthe principles of the invention and its practical application, tothereby enable others skilled in the art to best utilize the inventionin various embodiments and with various modifications as are suited tothe particular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1. A non-volatile storage system, comprising: a set of non-volatilestorage elements including at least a first non-volatile storageelement; and one or more control circuits in communication with the setof non-volatile storage elements, the one or more control circuits: (a)apply at least a first voltage to a selected word line which isassociated with the at least a first non-volatile storage element, (b)regulate a source voltage at a positive DC level for a source which isassociated with the at least a first non-volatile storage element duringat least a portion of a time in which the at least a first voltage isapplied, and (c) determine whether the at least a first non-volatilestorage element is in a conductive or non-conductive state using currentsensing while applying the at least a first voltage and regulating thesource voltage.
 2. The non-volatile storage system of claim 1, wherein:the one or more control circuits regulate a p-well voltage at a positiveDC level for a p-well which is associated with the at least a firstnon-volatile storage element during at least a portion of a time inwhich the at least a first voltage is applied.
 3. The non-volatilestorage system of claim 2, wherein: the source and p-well voltages areregulated at different DC levels.
 4. The non-volatile storage system ofclaim 2, wherein: the source and p-well voltages are regulated at acommon DC level.
 5. The non-volatile storage system of claim 1, wherein:the one or more control circuits ground a voltage of a p-well which isassociated with the at least a first non-volatile storage element duringat least a portion of a time in which the at least a first voltage isapplied.
 6. The non-volatile storage system of claim 1, wherein: the atleast a first non-volatile storage element has a negative thresholdvoltage.
 7. The non-volatile storage system of claim 1, wherein: the atleast a first non-volatile storage element is in a NAND string and thesource voltage is applied to a source side of the NAND string.
 8. Thenon-volatile storage system of claim 1, wherein: the one or more controlcircuits use the current sensing by determining a voltage drop which isproportional to a fixed current which flows through the at least a firstnon-volatile storage element and sinks into the source when the at leasta first non-volatile storage element is in the conductive state.
 9. Thenon-volatile storage system of claim 1, wherein: the selected word lineis associated with non-volatile storage elements in a plurality ofadjacent NAND strings; the source is associated with each of thenon-volatile storage elements; and the one or more control circuitsdetermine, in concurrent sensing operations, whether each of thenon-volatile storage elements is in the conductive or non-conductivestate using current sensing while applying the at least a first voltageand during the regulating.
 10. The non-volatile storage system of claim1, wherein: during the current sensing, a fixed current flows throughthe at least a first non-volatile storage element and sinks into thesource when the at least a first non-volatile storage element is in theconductive state.
 11. A non-volatile storage system, comprising: a setof non-volatile storage elements including at least a first non-volatilestorage element; and one or more control circuits in communication withthe set of non-volatile storage elements, the one or more controlcircuits: (a) apply at least a first voltage to a selected word line ofthe at least a first non-volatile storage element, (b) regulate sourceand p-well voltages at respective positive DC levels for a source andp-well, respectively, which are associated with the at least a firstnon-volatile storage element during at least a portion of a time inwhich the at least a first voltage is applied, and (c) sense aprogramming condition of the at least a first non-volatile storageelement relative to a compare point using current sensing, whileapplying the at least a first voltage and regulating the source andp-well voltages.
 12. The non-volatile storage system of claim 11,wherein: the one or more control circuits regulate the source and p-wellvoltages at different positive DC levels.
 13. The non-volatile storagesystem of claim 11, wherein: the one or more control circuits regulatethe source and p-well voltages at a common positive DC level.
 14. Thenon-volatile storage system of claim 11, wherein: the programmingcondition is defined with respect to a negative threshold voltage, andthe at least a first voltage is a positive voltage.
 15. The non-volatilestorage system of claim 11, wherein: the programming condition isdefined with respect to a positive threshold voltage.
 16. A non-volatilestorage system, comprising: a set of non-volatile storage elementsincluding at least a first non-volatile storage element; and one or morecontrol circuits in communication with the set of non-volatile storageelements, the one or more control circuits: (a) provide a potential of adrain associated with the at least a first non-volatile storage elementabove a potential of a source associated with the at least a firstnon-volatile storage element, (b) apply at least a first voltage to aselected word line of the at least a first non-volatile storage element,(c) regulate source and p-well voltages at respective positive DC levelsfor a source and p-well, respectively, which are associated with the atleast a first non-volatile storage element during at least a portion ofa time in which the at least a first voltage is applied, (d) whileapplying the at least first voltage, and regulating the source andp-well voltages, perform current sensing with respect to a level of acurrent which flows through the at least a first non-volatile storageelement and sinks into the source, and (e) determine a programmingcondition of the at least a first non-volatile storage element accordingto the current sensing.
 17. The non-volatile storage system of claim 16,wherein: the one or more control circuits regulate the source and p-wellvoltages at different positive DC levels.
 18. The non-volatile storagesystem of claim 16, wherein: the one or more control circuits regulatethe source and p-well voltages at a common positive DC level.
 19. Thenon-volatile storage system of claim 16, wherein: the programmingcondition is defined with respect to a negative threshold voltage, andthe at least first voltage is a positive voltage.
 20. The non-volatilestorage system of claim 16, wherein: the programming condition isdefined with respect to a positive threshold voltage.